Liqiang ZHANG

Ph.D.

School of Mechanical Engineering,

Jiangsu University, Zhenjiang, 212013, PR. China

PHONE：(86)013337740075

FAX：

E-mail：zhanglq4158@ujs.edu.cn;

zhangliqiang010@sina.com

Websites：

Research Interests:

(1) Advanced design manufacturing and Reliability of MEMS, SMT devices.

(2) Interface Heat transfer in nano/micro scale, Multiscale Modeling.

(3) Microcomputer control technology.

Education Background：

2014.03-present Postdoctoral, Materials Science and Engineering, Jiangsu University, Zhenjiang, Jiangsu Province P.R. China

2009.06-2012.12 Ph.D., Mechanical Electronic Engineering, Jiangsu University, Zhenjiang, Jiangsu Province P.R. China

2006.09-2009.06 M.S., Mechanical Electronic Engineering, Guilin University of Electronic Technology, Guilin, Guangxi Province P.R. China

2002.09-2006.06 B.S., Mechanical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi Province P.R. China

Working Experience:

2013.1-present Teacher Department of Mechanical Electronic Engineering, School of Mechanical Engineering, Jiangsu University

Teaching Courses:

1) Numerical Control & Computer Numerical Control (NC & CNC)

2) Microcomputer Principle and interfacial technology

3) Microcomputer Control Technology

4) Innovation of Mechanical and Electrical system

Selected Most Recent Publications:

[1] Size effect on Heat Transfer Performance of ZnO/Al₂O₃ Interface Materials, Int. J. Materials and Structural Integrity, 2015, In Press

[2] Investigation on Thermal Reliability and Optimization Design for High-power LED Micro/nano System, Int. J. Materials and Structural Integrity, 2015, 9:173-179.

[3] Experimental Investigation on the Growth Rate of Cu NAno-thin Films by DC and RF Magnetron Sputtering Methods, Int. J. Materials and Structural Integrity, 2015, 8:303-309.

[4] Interfacial Heat Transfer Properties of the Typical Interconnection Structures in IC Packaging: A Multiscale Study, Int. J. Materials and Structural Integrity, 2014, 8:110-120.

[5] Investigation on the Reliability of Board-Level Interconnection under the Thermal Cycle Loading, International Conference on Elctronics, Circuits, and Systems, shenzhen, 2014, 207-213.

[6] Multiscale Investigation on Interfacial Properties of Cu/Al Structures in Electronic Packaging, Applied Mechanics and Materials, 2014, 455, 60-65.

[7] The Effect of Phonon and Electron on Thermal Characteristics of Cu/Al Interface, Current Nanoscience, 2014, 9(6):747-752.

[8] Numerical Investigation on Thermal Properties at Cu-Al Interface in Micronano Manufacturing, Applied Surface Science, 2012, 258:3975-3979.

[9] Comparison Approach on Mechanical Behavior of Al Cr Nano-Interface and CuCr Nano-Interface, Current Nanoscience, 2012, 8:715-719

[10] Numerical Evaluation on Heat Transport Characteristics between Al₂O₃ and ZnO Materials in Nanoscale Situation, ACS Applied Materials & Interfaces, 2011, 4:158-162.

Awards and Honors:

Society Memberships：