Quan WANG

Professor

ADDRESS：School of Mechanical Engineering, Jiangsu University, Xuefu Road 301#, Zhenjiang, 212013, Jiangsu Province, P. R. China

PHONE：+86 511-88791548; 13812459941

E-mail：wangq@ujs.edu.cn; wangquan100@126.com

Websites：

Research Interest

MEMS (Microelectromechanical Systems); NEMS (Nanoelectromechanical Systems); Nanotechnology; design and manufacturing of microsensors and microactuators; development of micromachining processes by silicon surface/bulk micromachining; mechanical issues in MEMS thin film

Education Background

Ø 2004.9-2007.6, Ph.D. degree in Mechanical Electronic Engineering, Center of Micro / Nano Science and Technology, Jiangsu University

Ø 2002.9-2005.6, Master’s degree in Mechanical Electronic Engineering, Center of Micro / Nano Science and Technology, Jiangsu University

Research Achievement

Papers

1. Quan Wang, Xinxin Li, Tie Li, Minhang Bao, Wei Zhou. On-chip integration of acceleration, pressure and temperature composite sensor with a single-sided, IEEE Journal of Microelectromechanical Systems, 2011，20(1):42-52

2. Quan Wang, Jin Zhang, Ran Hu , Ying Shao. Automatic Two Axes Sun-tracking System Applied to Photovoltaic System for LED Street Light, Applied Mechanics and Materials, 2011, 43:17-20

3. Quan Wang, Jin Zhang , Ran Hu, Guoqiang Sun. Transistor Compensation Technology of Pressure Sensor SensitivityTemperature Coefficient, Applied Mechanics and Materials, 2011, 43 : 371-375

4. Quan Wang, Ran Hu , Jin Zhang, Leilei Jiang. Mechanical Behavior Experimental Study of Microstructure under Tensile loading and Electric Field, Key Engineering Materials, 2011,464 : 383-386

5. Quan Wang, Xinxin Li. A monolithically integrated 3-axis thermal-convective accelerometer with a pneumatically curved thermopile-cantilever for Z-axis sensing, Transducers 2011, Beijing, China, June 5-9, 2011,pp.2018-2021

6. Quan Wang, Ran Hu, Jin Zhang, Ping Yang. Au surface mechanical behavior research with electro-thermo-mechanical coupled service using atomic force microscope, 2011, Applied Mechanics and Materials, 2011,266 :209-212

7. Quan Wang, Huran, Yang xiaodan, dingjianning. Low-temperature silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality. Int. J. of Materials and Product Technology (IJMPT) (In Press)

8. Quan Wang, Huran, dingjianning, .Mechanical properties of thin films of hydrogenated silicon and their intrinsic relationship with microstructure. Applied physics.A (In Press)

9. Quan Wang, Xinxin Li, Tie Li, Minhang Bao, Kun Zhang, Xiaohong Ge, Wei Zhou and Haifei Bao. A monolithically integrated pressure, accelerometer and temperature composite sensor. Transducers 2009，Denver，CO，USA，June 21-25，2009

10. Quan Wang，Jianning Ding， Wei Xue，Zhiyong Ling . Micromachining process of high temperature pressure sensor gauge chip based on SIMOX SOI wafer. The International Journal of Materials and Product Technology，2008， 31（2/3/4）：375-383