On the afternoon of March 22, at the invitation of the Department of Instrument Science and engineering of the school of mechanical engineering, the appointment ceremony and academic report meeting of the famous non-destructive testing expert bond Professor were held in the lecture hall on the seventh floor of the mechanical building. Xu Zhenying, vice president of the school of mechanical engineering, issued the letter of appointment and wore the school emblem for Professor bond. The meeting was presided over by Professor Song Shoupeng, director of the Department of instruments. All the teachers, graduate students and the school of instruments Teachers and students from related fields attended the ceremony.

After the engagement ceremony, Professor bond made an academic report entitled "global trends: the future for NDE", reviewed the development process of NDT, and looked forward to the development trend of NDT in the future. After the report meeting, he visited the NDT research room of the instrument department, listened to the research status report of the research room, and finally had extensive and in-depth exchanges with teachers and students in the conference room of the mechanical college, laying the foundation for further cooperation in related fields.

Professor Leonard J. bond is a famous NDT expert in the world. He is currently the president of the world NDT Center Alliance, the president of the quantitative NDT conference, the researcher of Ames Lab of the National Laboratory of the United States, the director of the center for physical research and technology of Iowa State University of the United States, the member of the American Society of advanced sciences and the member of the British physical society. More than 450 papers have been published, of which h index is 30 and H 10 index is 85. At present, Professor bond is committed to the application and development of nondestructive testing in additive manufacturing, realizing the intellectualization, foresight and foresight of nondestructive testing.