Publications(selected by latest 3 years) 1. Testing on dynamic behavior of PBGA assembly by considering fixed-modes. Microelectronics International, 2011,28(2), p23-29 2. Numerical and test evaluation on adhesion properties in Cr/Al interface film. Current Nanoscience, 2011,7(2), 288-293 3. Numerical and experimental investigation for the effects of thermal loading on properties of nanoscale materials interface. Materials Science & Engineering A, 2010, 527, 6076–6081 4. Nanoindentation test and numerical evaluation of Cu-Cr interface structure in micro/nano manufacturing. Composite Interfaces, 2010,17, 789–801 5. Numerical simulation of heat transfer at the interface of dissimilar materials. International Journal of Numerical Methods for Heat & Fluid Flow, 2010, 20(1) , p84-95 6. Experimental approach and evaluation on dynamic reliability of PBGA assembly. IEEE Transactions on Electron Devices, 2009, Vol.56, No.10, p2243-2249 7. Behavior of nanocracks on micro/nano-interfacial structure under thermal flux conditions. Current Nanoscience, 2009, 5(3), p335-338 8. Multi-scale Modeling and Numerical Analysis of Thermal Behavior of Cu-Al Interface Structure in Micro/nano Manufacturing. International Journal of Nonlinear Sciences and Numerical Simulation, 2009, 10(4), 483-491 9. Approach on complex neural-genetic algorithm modeling for isomorphism identification in conceptual design of mechanism. Computer Systems Science and Engineering, 2009, 24(6), p423-431 10.Physical mechanism of interfacial thermal resistance in electronic packaging based on a mixed MD/FE model. IEEE transactions on advanced packaging, 2008, 31(3),p 496-501 11.Numerical analysis on meshing friction characteristics of nano-gear train. Tribology International, 2008,4(6),p 535-541 12.Research on characteristics of interfacial heat transport between two kinds of materials using a mixed MD-FE model. Applied Physics A-materials science & processing, 2008, 92, 329–335 |