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张立强,男,博士,山东潍坊人(1984年- )。

2006-2009年就读于桂林电子科技大学并获硕士学位,2009-2012年就读于江苏大学并获工学博士学位,并获江苏大学优秀博士论文。参与国家自然科学基金4项,江苏省自然基金1项,主持江苏省普通高校研究生科研创新计划1项(结题)。主持江苏省自然科学基金1项(在研)及江苏大学高级人才启动基金1项(在研)。在Applied surface science, Current Nanoscience 等国外期刊发表论文相关学术论文10余篇,申请发明专利3项,并获中国电子学会科学技术二等奖(2013年度,排名第四)、江苏省科学技术奖三等奖(2012年度,排名第三)。

主要研究领域

  1. LED器件/电子封装可靠性研究
  2. 微尺度传热与多尺度分析
  3. 机电系统弱电控制设计研究

通讯地址及联系方式

通讯地址:江苏省镇江市学府路301号,江苏大学机械工程学院机械电子工程系

Email:zhanglq4158@ujs.edu.cn; zhangliqiang010@sina.com

TEL: 15706173494

代表性学术论著

  • Liqiang Zhang, Ping Yang,Min Chen, Ningbo Liao. Numerical investigation on thermal properties at Cu-Al interface in micro/nano manufacturing. Applied Surface Science, 2012, 258:3975-3979.
  • Liqiang Zhang, Ping Yang, Shuaihua Shang, Chunquan Li, Xifu Song. Nanoindentation experimental approach and numerical simulation of Al-Cr bilayer films.Composite Interfaces, 2011, 18:615-626.
  • Ping Yang, Haifeng Xu, Liqiang Zhang, Fangwei Xie, Jianming Yang. Numerical evaluation on heat transport characteristics between Al2O3 and ZnO materials in nanoscale situation. ACS Applied Materials & Interfaces, 2011, 4:158-162.
  • Liqiang Zhang, Ping Yang, Chun Li, Xuenan Wang, Xialong Li, Yanfang Zhao. Comparison Approach on Mechanical Behavior of Al Cr Nano-Interface and CuCr Nano-Interface.Current Nanoscience, 2012, 8:715-719.
  • Liqiang Zhang, Ping Yang, Yunqing Tang, Jie Gong, Xialong Li. The Effect of Phonon and Electron on Thermal Characteristics of Cu/Al Interface. Current Nanoscience, 2014, 9(6):747-752.
  • Liqiang Zhang, Dongjing Liu, Lijia Yu, Yanfang Zhao, Xiaoming Yuan, Jian Liu, Ping Yang. Multiscale Investigation on Interfacial Properties of Cu/Al Structures in Electronic Packaging. Applied Mechanics and Materials, 2014, 455, 60-65.
  • Liqiang Zhang, Yi Guo, Yunqing Tang, Dongjing Liu. Investigation on the electronic and optical properties of Al-doped ZnO nanostructures. International Journal of Materials and Structural Integrity, 2013, 7(4):251-259.
  • Liqiang Zhang, Zhaohua Wu, Xianxin Xu, Haifeng Xu, Yongsheng Wu, Pei Li, Ping Yang. Approach on thermoelectricity reliability of board-level backplane based on the orthogonal experiment design, International Journal of Materials and Structural Integrity, 2011, 4(2-4): 170-185.
  • Liqiang Zhang, Yunqing Tang, Jie Gong, Dongjing Liu, Lijia Yu, Lin Deng, Zhibao Li, Liangze Zhi. Interfacial Heat Transfer Properties of the Typical Interconnection Structures in IC Packaging: A Multiscale Study. International Journal of Materials and Structural Integrity, 2014, 8(1-3): 110-120.
  • Liqiang Zhang, Ping Yang, Xiaoliang Wang, Pei Li, Huan Wang. MD-ISE-FE Multi-scale Modeling of Interface Structure in Microelectronic Devices, International Conference on Electric Information and Control Engineering (ICEICE), Wuhan, 2011, 3343-3346.
  • Liqiang Zhang, Ping Yang, Fangwei Xie, Tao Xi, Xingang Yu, Xifu Song. MD-ISE-FE Multiscale Modeling and Numerical Simulation of Thermal Conductivity of Cu Film Interface Structure,Advanced Materials Research, 2012, 282: 242-246.
  • Liqiang Zhang, Zhaohua Wu, Dongjing Liu, Xiaoming Yuan, Zhibao Li. Investigation on the Reliability of Board-Level Interconnection under the Thermal Cycle Loading. International Conference on Environmental and Computer Science, International Conference on Electronics, Circuits, and Systems, Shenzhen, 2014, 207-213.
  • Liqiang Zhang, Ping Yang, Xiaoliang Wang, Pei Li, Huan Wang. MD-ISE-FE multi-scale modeling of interface structure in microelectronic devices. 2011 ICEICE, 3343-3346.
  • Liqiang Zhang, Chaoyan Xu, Yunqing Tang. Experimental Investigation on the Growth Rate of Cu Nano-thin films by DC & RF Magnetron Sputtering Methods. International Journal of Materials and Structural Integrity, In Press.

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